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The original plan was to distribute the production capacity equally to Sony/Microsoft. But now Microsoft are making so many SoCs that even eating up all Sony’s capacity, TSMC needs to find other foundries to support Sony. A little bit embarrassing situation for them.
Sure they could fully turn to the Taichung Fab (I guess, and it’s 12 inch), but I think it’s unlikely because of 2).
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TSMC has used Sony’s design to do CSAM and FIB. The problem Sony has needs to be solved from the foundry side, the assembly side can’t help. AMD might feel tired of those problems too.
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